- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 55/06 - Dust extraction equipment on grinding or polishing machines
Patent holdings for IPC class B24B 55/06
Total number of patents in this class: 298
10-year publication summary
|
15
|
15
|
13
|
39
|
39
|
31
|
47
|
39
|
34
|
14
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 1951 |
20 |
| Tokyo Electron Limited | 11599 |
14 |
| Husqvarna AB | 2824 |
14 |
| 3m Innovative Properties Company | 18406 |
12 |
| Applied Materials, Inc. | 16587 |
10 |
| Canvas Construction, Inc. | 26 |
10 |
| Towa Corporation | 236 |
8 |
| JPL Global, LLC | 85 |
6 |
| Saint-Gobain Abrasifs | 657 |
6 |
| Saint-Gobain Abrasives, Inc. | 895 |
6 |
| FerRobotics Compliant Robot Technology GmbH | 64 |
5 |
| Shin-Etsu Handotai Co., Ltd. | 1277 |
4 |
| Mirka Ltd | 163 |
4 |
| Ancora S.p.A. | 27 |
4 |
| Semiconductor Components Industries, L.L.C. | 5345 |
3 |
| NTN Corporation | 5008 |
3 |
| Hilti Aktiengesellschaft | 3227 |
3 |
| Makita Corporation | 2339 |
3 |
| Disco Corporation | 1745 |
3 |
| Tokyo Seimitsu Co., Ltd. | 257 |
3 |
| Other owners | 157 |